X-Ray Beam Metrology
3D BGA Inspection
OCR/Barcodes
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Octaveo Features

- Combined Shape Recognition and Precision Metrology

- Fast Shape Uniformity and Coplanarity Measurements (<200 ms)

- High Measurement Repeatability (.5% Typical for 2D Metrology)

- Flexible Script Driven Environment

- Advanced Grid Fitting Algorithm Detects BGA Chip Warpage

- Selectable Site Depopulation

- Optoisolated Input/Outputs

- Rugged Industrial Camera Housing

- Models 50/80/100/200

- Integration Services and Training

Structured Lighting and Precision Subpixel Processing Provide Fast and Accurate BGA Measurements.

The Octaveo family of BGA/CSP inspection systems combines the power of pattern recognition with the power of precision metrology. Structured lighting and highly optimized metrology algorithms provide blazing speed for detection of missing, deformed, or misaligned solder balls as well as isolation of individual ball height deviations from coplanarity. A powerful scripting environment allows test engineers to customize production mode test sequences for individual styles and sizes of BGA chips as well as binning of the measurement results.

Standard Octaveo models are equipped with 1.3 megapixel cameras and optics that were selected for processing solder balls from .1 to .5 mm in diameter. Within this range, BGA sizes typically vary from 1 to 13 millimeters. Optional higher resolution cameras and specialized optics can be requested for chips that fall outside of these parameters. The software can handle array sizes up to 30x30 balls. Any amount of site depopulation is supported.

BGA chips are presented to a 90 mm wide viewing port located at one end of the enclosure that holds the cameras, optics, lighting, and interface electronics. Chips should be located 6-9 millimeters from the bottom surface of the enclosure, which may be mounted in any orientation.

We offer a variety of pricing options to satisfy the budget requirements of any manufacturing, assembly, or test facility.

The Octaveo Family:
ModelProcessing ModeHardware
Model 50On-Axis Analysis
  Diameter Metrology
  Curvature Metrology
  Shape Filtering
  Grid Fitting
Mini enclosure
  On-Axis camera only
  Pentium 4
Model 80Off-Axis Analysis
  Diameter Metrology
  Curvature Metrology
  Shape Filtering
  Height/Coplanarity
  Grid Fitting
Standard enclosure
  Off-Axis camera only
  Pentium 4
Model 100Combined Features
  of Models 50 and 80
Standard enclosure
  Pentium 4
Model 200Combined Features
  of Models 50 and 80
Standard enclosure
  Dual Pentium 4 computers


Shown above is an On-Axis simulation of four solder balls being illuminated with Octaveo structured lighting. Octaveo can be trained to selectively reject shapes that don't match the ideal sphere shown in the upper left corner.


Our new Model 152 features stereo 2 Megapixel cameras with macro zoom lenses to measure chips from .2 to 25 mm on a side. See the Downloads section of the website for the press release.

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Specifications:

BGA Parts:1

Ball Sizes:.1 - .5 mm
BGA Part Size:1 - 13mm
Balls/Partto 30 x 30 ball arrays
Handling:30 ms min. stop time,
settled before trigger

Optical System:1

On-Axis Resolution1280 x 1024 pixels
InterfaceIEEE 1394 Firewire
Off-Axis Resolution1280 x 1024 pixels
InterfaceCameraLink
On-Axis Accuracy:under 2%
Off-Axis Accuracy:under 5%
Curvature Accuracy:under 3-10%
 (mode dependent)

System Throughput:2

Model 50 On-Axis:5-10 parts/sec
(50 ms data strobe - parts in place 30 ms
before trigger)
Model 80 Off-Axis:5.2 parts/sec
with Curvature:3.0 parts/sec
(50 ms data strobe - parts in place 30ms
before trigger)
Model 100:2.0 parts/sec
(Combined On-Axis, Off-Axis, and curvature
processing with 50 ms data strobe - parts
in place 100 ms before trigger)
Model 200:2.5 parts/sec
(Combined On-Axis, Off-Axis, and curvature
processing with 50 ms data strobe - parts
in place 50 ms before trigger)

Physical:

Standard Enclosure:NEMA Style (Steel)
  H x W x D41 x 33 x 16.5 cm
17 x 13 x 6.5 in
Mini Enclosure:NEMA Style (Steel)
  H x W x D34 x 27 x 14 cm
13.5 x 10.5 x 5.5 in
I/O SignalsTrigger input, 8 Outputs, all Optoisolated
Computer:Core 2 Duo E8400, 500 GB HD, Ethernet,
LCD, Keyboard, Windows XP Pro
Electrical Power
  Computer110v, 4a
Environment5 to 30 deg;
90% humid no condense
Minimal vibration

NOTES

1. Contact us for custom optics and higher camera resolutions.
2. Cameras are in free running mode with standard models. Hardware triggering may be specified to improve throughput.