
Octaveo Features- Combined Shape Recognition and Precision Metrology- Fast Shape Uniformity and Coplanarity Measurements (<200 ms) - High Measurement Repeatability (.5% Typical for 2D Metrology) - Flexible Script Driven Environment - Advanced Grid Fitting Algorithm Detects BGA Chip Warpage - Selectable Site Depopulation - Optoisolated Input/Outputs - Rugged Industrial Camera Housing - Models 50/80/100/200 - Integration Services and Training
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![]() The Octaveo family of BGA/CSP inspection systems combines the power of pattern recognition with the power of precision metrology. Structured lighting and highly optimized metrology algorithms provide blazing speed for detection of missing, deformed, or misaligned solder balls as well as isolation of individual ball height deviations from coplanarity. A powerful scripting environment allows test engineers to customize production mode test sequences for individual styles and sizes of BGA chips as well as binning of the measurement results. Standard Octaveo models are equipped with 1.3 megapixel cameras and optics that were selected for processing solder balls from .1 to .5 mm in diameter. Within this range, BGA sizes typically vary from 1 to 13 millimeters. Optional higher resolution cameras and specialized optics can be requested for chips that fall outside of these parameters. The software can handle array sizes up to 30x30 balls. Any amount of site depopulation is supported. BGA chips are presented to a 90 mm wide viewing port located at one end of the enclosure that holds the cameras, optics, lighting, and interface electronics. Chips should be located 6-9 millimeters from the bottom surface of the enclosure, which may be mounted in any orientation. We offer a variety of pricing options to satisfy the budget requirements of any manufacturing, assembly, or test facility. |
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The Octaveo Family:
![]() Shown above is an On-Axis simulation of four solder balls being illuminated with Octaveo structured lighting. Octaveo can be trained to selectively reject shapes that don't match the ideal sphere shown in the upper left corner.
![]() Our new Model 152 features stereo 2 Megapixel cameras with macro zoom lenses to measure chips from .2 to 25 mm on a side. See the Downloads section of the website for the press release.
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BGA Parts:1
Optical System:1
System Throughput:2
Physical:
NOTES
1. Contact us for custom optics and higher camera resolutions. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||